2570 Low viscosity room temperature curing modified resin three-proof adhesive

Features and parameters

Single component, low viscosity, room temperature curing modified resins for the protection of circuit boards and their associated
equipment from corrosion, thus improving and extending their service life and ensuring the safety and reliability of use.
safety and reliability. Widely used in tropical electrical products, relay
equipment, marine instrumentation, thermal instrumentation, precision instruments, carrier communication, electronic components protection
and machine protection, moisture-proof, water-proof encapsulation of delicate electronic parts, insulation and coating protection of various electric
circuit boards; waterproof coatings for electrical and communication equipment; waterproof packages for LED Display modules and pixels.
waterproof package for LED display modules and pixels.

Model:2570
Viscosity(25°C/cp s):200~300
Crusting time(25Cmin):40~50
Initial curing time(25C):2~3H
Full curing time(h):24h
Color:translucent
Hardness:35(A)
Full curing time(25°C):24H
Temperature range(°C):-55-200
Long open time, suitable for thick layer dip coating, excellent weathering and aging resistance.